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The Electronic Packaging Laboratory is an interdisciplinary research center of the
University at Buffalo, The State University of New York. The purpose of this laboratory is to
develop the computational and experimental tools needed to develop the next generation of
nanoelectronics and nanophotonics devices.
Conducting research for the next generation of nanoelectronics/ nanophotonics requires
interdisciplinary collaboration between experts in solid mechanics, structural analysis, materials,
electronics, circuits, photonics, heat transfer, fluid mechanics, manufacturing and design. The
EPL strives to educate competitive and self-motivated students and professionals with state-of-
the-art knowledge in interdisciplinary research in a unique interdisciplinary environment.
Our graduates have been hired by Microsoft, IBM, Analog Devices, Honda Electronics,
Tyco Electronics, among many other prestigious companies.
Flip Chip Solder Joint Under EM+TM
Moire Interferometry
Multi-Scale Analysis of Electromigration and Thermomigration
bSn Surface Diffusivity
Molecular Dynamics Simulation
Finite Element Analysis
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