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Services
Computational Reliability Analysis and Design
Reliability and structural analysis for packages, interconnects, vias, interfaces, devices and substrates
Material/Interface modeling
Custom software development for life cycle analysis
Damage and fracture mechanics
Nonlinear Finite Element Analysis
- Thermo-elasto-viscoplastic fatigue analysis
- Mode shape/ Modal frequency analysis
Experimental Reliability Analysis and Design
- Thermal cycling, and vibration testing under extreme conditions
- Electro-migration and thermo-migration testing under high current density
- Lead-Free Solder Material Selection
- Material and Interface Characterization
- Failure Mode Characterization
- Screening and HAST
- Nano-indentation studies for material property determination post manufacturing
- Solder Joint, IMC microstructure and metallurgy inspection
- Solder joint-UBM interface inspection
- Solder joint and printed circuit board quality and integrity studies
- Photo-damage-mechanics
- Moire Interferometry
- Twyman-Green and Speckle Interferometry
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