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Publications
|
1. |
Cheng-yong
Yan, "A Damage Mechanics Based General Purpose Interface/Contact Element,"
February, 1998, PhD Dissertation |
|
2. |
Rumpa
Chandaroy, "Damage Mechanics of Microelectronics Packaging Under Combined
Dynamic & Thermal Loading" August 1998, PhD Dissertation |
|
3. |
Ying Zhao,"
Mechanics of Ball Grid Array Packages: Testing and Modeling,” December 2000, PhD
Dissertation. |
|
4. |
Hong Tang,
“A Thermodynamic Damage Mechanics Theory and Experimental Verification: For
Thermomechanical Fatigue Life Prediction of Microelectronics” November 2002, PhD
Dissertation. |
|
5. |
Heng
Liu,”Phase Reconstruction of Phase Shifted Moire Interferograms Using Continuous
Wavelet Transforms,” July 2003, PhD Dissertation. |
|
6. |
Yujun Wen,
“Thermomechanical Analysis of Multilayered Microelectronic Packaging: Modeling
and testing” December 2003, PhD Dissertation. |
|
7. |
Hua
Ye,”Mechanical Behavior of Microelectronics and Power Electronics Solder Joints
Under High Current Density: Analytical Modeling and Experimental Investigation”,
March 2004, PhD Dissertation. |
|
8. |
Shihua Nie,”
A Micromechanical Study on Damage Mechanics of Acrylic Particulate Composites
Under Thermomechanical Loadings” May 2005, PhD Dissertation. |
|
9. |
Juan Gomez
“A Thermodynamic Framework for Damage Mechanics of Electronic Packaging Solder
Joints Including Size Effects”, February 2006, PhD Dissertation.
|
|
10. |
Minghui Lin,”
A Thermodynamic Framework for Damage Mechanics of Electromigration and
Thermomigration”, September 2006, PhD Dissertation.
|
|
11. |
Mohammed Abdulhamid, " Thermomigration; An Experimental Damage Mechanics Study
on Nanoelectronics Lead-free Solder Alloys, " May 2008, PhD Dissertation |
|
12. |
Shidong Li, "A
Multi-Scale Damage Mechanics Framework for Nanoelectronics Interconnects and
Solder Joints, " May 2009, PhD Dissertation |
|
13. |
Tarek
Ragab, "A Multi-Scale Electro-Thermo-Mechanical Analysis of Single Walled Carbon
Nanotubes," May 2010, PhD Dissertation |
|
14. |
Michael
Sellers, "Atomistic Modeling Of The Microstructure And Transport Properties Of
Lead-Free Solder Alloys," August 2010, PhD Dissertation |
|
15. |
Mustafa
Eray Gunel, " Large Deformation Micromechanics of Particle Filled Acrylics at
Elevated Temperatures," August 2010, PhD Dissertation |
|
16. |
Rumpa Chandaroy, “Nonlinear Dynamic Analysis of Microelectronic Packaging
Interconnects “, December 1996, MS Thesis. |
|
17. |
Jianbin Jiang,”Size Effect for Pb/Sn Solder Alloys and Its Measurement by Nano
Indentation” May 2002, MS Theses |
|
18. |
Desai, C.S., Basaran, C., and Wu, Z. "Numerical Algorithms and Mesh Dependence
in the Disturbed State Concept," Int. Journal for Numerical Methods in
Engineering, Vol. 40, 3059-3083, 1997. |
|
19. |
Basaran, C., and Chandaroy, R.,"Finite Element Simulation of the Temperature
Cycling Tests," IEEE, Transactions on Components Packaging and Manufacturing
Technology -Part A, Vol. 20, No. 4, pp. 530-536, 1997.#3 |
|
20. |
Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element
Analysis of Problems in Electronic Packaging Using the Disturbed State Concept
Part I: Theory and Formulation " Trans. of ASME, Journal of Electronic
Packaging, Vol. 120, No. 1, pp. 41-47, 1998. |
|
21. |
Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element
Analysis of Problems in Electronic Packaging Using the Disturbed State Concept
Constitutive Models: Part II: Verification and Application ", Trans. of ASME,
Journal of Electronic Packaging, Vol. 120, No. 1, pp. 48-53, 1998. |
|
22. |
Desai, C. S., Basaran, C., Dishongh, T. and Prince, J.,"Thermomechanical
Analysis in Electronic Packaging with Unified Constitutive Models for Materials
and Joints,” IEEE Trans. on Comp. Pack. And Manu. Tech, Part B, Trans. on
Advanced Packaging, Vol. 21, No. 1, 87-97, 1998. |
|
23. |
Basaran, C., and Chandaroy, R., "Mechanics of Pb40/Sn60 Near –Eutectic Solder
Alloys Subjected to Vibrations," Journal of Applied Mathematical Modeling, Vol.
22, pp. 601-627, 1998.#8
|
|
24. |
Basaran, C., and Yan. C.Y."A Thermodynamic Framework for Damage Mechanics of
Solder Joints,” Trans. of ASME, Journal of Electronic Packaging, Vol. 120,
379-384, 1998. #12 |
|
25. |
Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount
Interconnects, Part I: Theory", Trans. of ASME, Journal of Electronic Packaging,
Vol. 121, Number 1, pp. 8-12, March 1999. #7a |
|
26. |
Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount
Interconnects, Part II: Applications", Trans. of ASME, Journal of Electronic
Packaging, Vol. 121, No 1, pp. 12-17, March 1999. #7b |
|
27. |
Chandaroy, R. and Basaran, C.,"Damage Mechanics of Surface Mount Technology
Solder Joints Under Concurrent Thermal and Dynamic Loadings," Trans. of ASME,
Journal of Electronic Packaging, Vol. 121, pp. 61-68, 1999. |
|
28. |
Basaran, C.,”Using Finite Element Analysis for Simulation of Reliability Tests
on Solder Joints in Microelectronics Packaging,” Computers & Structures, Vol.
74, Issue 2, pp. 215-231, November, 1999. #9 |
|
29. |
Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated
Stacks,” Int. J. of Finite Elements in Analysis and Design, 32, pp.163-179,
1999. #5 |
|
30. |
Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T.,”Thermomechanical
Behavior of Micron Scale Solder Joints: An Experimental Observation,” Journal of
the Mechanical Behavior of Materials, Vol. 10, No. 3, pp. 135-146, 1999. #13 |
|
31. |
Zhao, Y., Basaran, C. Cartwright, A. and Dishongh, T.,”Thermomechanical Behavior
of Micron Scale Solder Joints Under Dynamic Loads,” Mechanics of Materials, Vol.
32, Issue 3, pp. 161-173, 2000. #14 |
|
32. |
Basaran, C., Zhao, Y., Cartwright, A. and Dishongh, T.,”Effects of Thermodynamic
Loading,” Advanced Packaging, Vol. 1, pp. 51-58, October 2000. Review
article.#17 |
|
33. |
Basaran, C.,” Disturbed State Concept for Metals and Alloys,” J. of Mechanical
Behavior of Materials Vol. 10, No. 5-6, pp. 279-311, 2000. |
|
34. |
Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEA for Multilayered Electronic
Packaging,” Trans. of ASME, Journal of Electronic Packaging, Vol. 123, 3, pp.
218-224, September 2001. #22 |
|
35. |
Basaran, C., Cartwright, A. and Zhao, Y.,”Experimental Damage Mechanics of
Microelectronics Solder Joints Under Concurrent Vibration and Thermal Loading,”
Int. J. of Damage Mechanics, Vol. 10, No. 2 pp. 153-170, April 2001. #15 |
|
36. |
Basaran, C., Tang, H., Dishongh, T. and Searls, D.,”Computer Simulations of
Solder Joint Reliability Tests,” Advanced Packaging, Vol. 1, pp. 17-22, May
2001.Review article. #27 |
|
37. |
Basaran, C., Dishongh, T., and Zhao, Y.,” Selecting a Temperature Time History
for Predicting Fatigue Life of Microelectronics Solder Joints,” Journal of
Thermal Stresses, Vol. 24, No. 11, pp. 1063-1084, November, 2001. #20 |
|
38. |
Tang, H. and Basaran, C.”Influence of Microstructure Coarsening on
Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints,” Int. Journal
of Damage Mechanics, Vol. 10, No 3, pp. 235-255, July 2001. #29 |
|
39. |
Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under
Thermal and Vibrational Loading,” Tran. ASME Journal of Electronic Packaging,
Vol. 124, No 1, pp. 60-67, March 2002. #24 |
|
40. |
Basaran, C., Ye, H., Johnson, R. and Long, J., ”Moire Interferometry for
Inspecting BGA Solder Balls for Manufacturing Defects,” Journal of Global SMT
and Packaging, Vol. 2, No. 2, pp. 9-14, May 2002. #33 |
|
41. |
Basaran, C. and Tang, H.,”Implementation of a Thermodynamic Framework for Damage
Mechanics of Solder Interconnects in Microelectronic Packaging,” International
Journal of Damage Mechanics, Vol. 11, No. 1, pp. 87-108, January 2002. #17 |
|
42. |
Basaran, C., Ye, H., Bush, P., Johnson, R., and Long, J.,” Inspection of Under
Bump Metallization – Solder Ball Interfaces by SEM, EDX and Moire
Interferometry,” TAP Technology, Vol. 4, pp. 23-27, 2002, Review article.#31 |
|
43. |
Ye, H., Lin, M., and Basaran, C.,”Failure Modes and FEM Analysis of Power
Electronic Packaging,” Finite Elements in Analysis and Design, Vol. 38, Issue 7,
pp. 601-612, May 2002. #25 |
|
44. |
Basaran, C. and Jiang, J.,”Measuring Intrinsic Elastic Modulus of Pb/Sn Solder
Alloys,” Mechanics of Materials, 34, pp. 349-362, 2002, #26 |
|
45. |
Basaran, C., Cartwright, A., Zhao, Y. and Dishongh, T.”Reliability of Solder
Bumps”, Advanced Packaging, Vol. 1, pp. 47-56, July 2002, Review Article. #52 |
|
46. |
Dishong, T., Basaran, C., Cartwright, A., Zhao, Y., and Liu, H., “Impact of
Temperature Cycle Profile on Fatigue Life of Solder Joints,” IEEE Transactions
on Advanced Packaging, Vol. 25, No 3, pp. 433 –438, August 2002. #35 |
|
47. |
Tang, H. and Basaran, C.”A Damage Mechanics Based Fatigue Life Prediction
Model,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp.
120-125, March 2003. #21 |
|
48. |
Wen, Y. and Basaran, C.,”Thermal Stress Analysis of Multilayered Microelectronic
Packaging,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp.
134-138, March 2003. #23
|
|
49. |
Ye,
H., Basaran, C. and Hopkins, D., Thermomigration in Pb-Sn Solder Joints Under
Joule Heating During Electric Current Stressing, Applied Physics Letters, Vol.
82, No 8, February 2003, #38.. |
|
50. |
Wen , Y.and Basaran, C. “Analysis of Multi-layered Microelectronic Packaging
Under Uniformly Distributed Loading”, vol 40/13-14, pp 3331 - 3345,
International. J. of Solids and Structures, May 2003, #45 |
|
51. |
Ye, H., Hopkins, D. and Basaran, C.”Measuring Joint Reliability: Applying the
Moire Interferometry Technique,” Advanced Packaging, Vol. 1, pp.17-20, May 2003,
Review article. #46 |
|
52. |
Ye,
H., Basaran, C. and Hopkins, D., Damage Mechanics of Microelectronics Solder
Joints Under High Current Densities,” International Journal of Solids and
Structures, Vol. 40, No. 15, pp. 4021-4032, July 2003. #34 |
|
53. |
Basaran, C. and Wen, Y.,”Coarsening in BGA Solder Balls: Modeling and
Experimental Evaluation,” Trans. Of ASME J. of Electronic Packaging , Vol 125,
No. 3, pp. 426-430, September 2003, #30
|
|
54. |
Liu, H., Cartwright, A. N. and Basaran, C.,” Sensitivity Improvement in Phase
Shifted Moiré Interferograms Using 1-D Continuous Wavelet Transform Image
Processing”, Optical Engineering 42(09), pp. 2646-2652, September 2003, #50 |
|
55. |
Ye,
H., Hopkins, D. and Basaran, C.,”Measurement of High Electrical Current Density
Effects in Solder Joints,” Advanced Microelectronics, Vol. 30, No. 5, pp. 13-16,
September 2003, Review Article.#69 |
|
56. |
Ye,
H., Basaran, C. Hopkins, D.,”Numerical Simulation of Stress Evolution During
Electromigration in IC Interconnect Lines,” IEEE Trans. On Comp. Packaging Tech.
Vol. 26, No. 3 pp.673-681, September 2003.#43 |
|
57. |
Basaran, C., Lin, M. and Ye. H. “A Thermodynamic Model for Electrical Current
Induced Damage”, Int. Journal of Solids and Structures Vol. 40, No 26 pp.
7315-7327, November 2003 #37 |
|
58. |
Ye,
H., Basaran, C. and Hopkins, D.,”Mechanical Degradation of Microelectronics
Solder Joints Under Current Stressing,” Int. Journal of Solids and Structures,
Vol 40 No 26, pp 7269-7284, November 2003 #40 |
|
59. |
Ye,
H., Basaran, C. and Hopkins, D.,”Measurement of High Electrical Current Density
Effects in Solder Joints,” Microelectronics Reliability, Vol. 43, issue 12, pp.
2021-2029, December 2003. #42 |
|
60. |
Wen, Y. and Basaran, C.,”An Analytical Model for Thermal Stress Analysis of
Multi-layered Microelectronic Packaging,” Mechanics of Materials, 36, pp.
369-385, 2004. #47 |
|
61. |
Liu, H., Basaran, C., Cartwright, A. and Casey, W.,” Application of Moiré
Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA
Packages, IEEE Transactions on Components and Packaging Technologies, Vol. 27,
No 1, pp. 217- 223, March 2004. #28 |
|
62. |
Ye,
H., Basaran, C. and Hopkins, D.,”Pb Phase coarsening in eutectic Pb/Sn flip chip
solder joint under electrical current stressing,,” Int. J. of Solids and
Structures, 41, pp. 2743-2755, 2004. #48 |
|
63. |
Liu, H., Cartwright, A., and Basaran, C. Moiré interferogram Phase Extraction: A
Ridge Detection Algorithm Based on Continuous Wavelet Transform” Applied Optics,
Vol. 43, No. 4/1, pp.850-857, February 2004, #51. |
|
64. |
Liu, H., Cartwright, A. and Basaran, C.,”Experimental Verification of
Improvement of Phase Shifting Moire Interferometry and Wavelet-Based Image
Processing,” Optical Engineering, 43 (05) pp. 1206-1214, May 2004, #56 |
|
65. |
Basaran, C. Tang, H. and Nie, S.,”Experimental Damage Mechanics of
Microelectronics Solder Joints Under Fatigue Loading,” Mechanics of Materials,
36, pp. 1111-1121, August 2004, #36 |
|
66. |
Ye,
H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints
Under Current Stressing and Numerical Simulation I,” International Journal of
Solids and Structures, vol. 41, pp. 4939-4958, September 2004. #59 |
|
67. |
Ye,
H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints
Under Current Stressing and Numerical Simulation II,” International Journal of
Solids and Structures, vol. 41, pp. 4959-4973, September 2004, #60 |
|
68. |
Basaran, C. and Nie, S.”An Irreversible Thermodynamic Theory for Damage
Mechanics of Solids,” International Journal of Damage Mechanics, vol. 13, No 3,
pp 205-224, July 2004, #41 |
|
69. |
Ye,
H., Basaran, C., and Hopkins, D.,” Mechanical Implications of High Current
Densities in Flip Chip Solder Joints,” International Journal of Damage
Mechanics, Vol. 13, No. 4, pp 335-346, October 2004, #58 |
|
70. |
Gomez, J. and Basaran, C.”A Thermodynamics Based Damage Mechanics Constitutive
Model for Low Cycle Fatigue Analysis of Microelectronics Solder Joints
Incorporating Size Effect,” International Journal of Solids and Structures, Vol.
42, issue 13, pp. 3744-3772, (2005) #67.
|
|
71. |
Nie, S., and Basaran, C. “A Micromechanical Model for Effective Elastic
Properties of Particulate Composites with Imperfect Interfacial Bonds,”
International Journal of Solids and Structures Vol. 42, pp 4179-4191, 2005, #62 |
|
72. |
Lin, M., and Basaran, C.”Electromigration Induced Stress Analysis Using Fully
Coupled Mechanical-Diffusion Equations With Nonlinear Material Properties,”
Computational Materials Science, Vol. 34/1 pp. 82-98, May 2005, #64 |
|
73. |
Basaran, C., Ye, H. Hopkins, D., Frear, D. and Lin, J.K.”Failure Modes of Flip
Chip Solder Joints Under High Electrical Current Density,” Trans. Of ASME J. of
Electronic Packaging, vol. 127, pp. 157-163, June 2005 #53 |
|
74. |
Basaran, C., Zhao, Y., Tang, H. and Gomez, J..”A Damage Mechanics Based Unified
Constitutive Model for Solder Alloys,” Trans of ASME, Journal of Electronic
Packaging, Vol. 127, issue 3, pp. 208-214, September 2005 . #18 |
|
75. |
Ye,
H., Basaran, C. and Hopkins, D., ”Experimental Damage Mechanics of Micro/Power
Electronics of Solder Joints Under Electrical Current Stresses,” Int. J. of
Damage Mechanics, vol. 15, pp. 41-68, January 2006, #65 |
|
76. |
Gomez, J. and Basaran, C. “ Nanoindentation of Pb/Sn Solder Alloys; Experimental
and Finite Element Simulation Results”, Int. J. of Solids and Structures, vol.
43, (2006), pp. 1505-1527, 2006, #77 |
|
77. |
Gomez, J. and Basaran, C., ”Damage Mechanics Constitutive Model for Pb/Sn Solder
Joints Incorporating Nonlinear Kinematic Hardening and Rate Dependent Effects
Using a Return Mapping Integration Algorithm,” Mechanics of Materials, 38
(2006), 585-598. #72 |
|
78. |
Gomez, J, Lin, M. and Basaran, C. “Damage Mechanics Modeling of Concurrent
Thermal And Vibration Loading On Electronics Packaging” Multidiscipline Modeling
in Materials and Structures, Vol.2, No.3, pp. 309-326, July 2006. #71. |
|
79. |
Nie, S., Basaran, C., Hutchins, S. and Ergun, H,” Failure Mechanisms in PMMA/ATH
Acrylic Casting Dispersion,” Journal of Mechanical Behavior of Materials, Vol.
17, No 2, 2006, pp. 79-95, #39 |
|
80. |
Basaran, C. and Nie, S.“A Thermodynamics Based Damage Mechanics Model for
Particulate Composites,” International Journal of Solids and Structures, 44,
(2007) 1099-1114. #63 |
|
81. |
Basaran, C. and Wen, Y., ”Analysis of Multilayered Microelectronic Packaging
Under Thermal Gradient Loading,” IEEE Trans. On Components and Packaging
Technologies, vol. 29, no 4, pp. 850-855, December 2006, #75. |
|
82. |
Basaran, C. and Wen, Y. “Influence of Interfacial Compliances on
Thermomechanical Stresses in Multilayered Microelectronic Packaging,” IEEE
Trans. On Advanced Packaging, vol. 29, No. 4, pp. 666-673, November 2006,#61 |
|
83. |
Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration in
Microelectronics Copper Interconnects,” International Journal of Materials and
Structural Integrity, vol. 1, Nos1/2/3, 16-39, 2007, #76 |
|
84. |
Cemal Basaran and Minghui Lin “Electromigration Induced Strain Field Simulations
for Nanoelectronics Lead-Free Solder Joints”, Int. J. of Solids and Structures,
44, (2007), 4909-4924. #68. |
|
85. |
Gomez, J., and Basaran, C., ”Determination of Strain Gradient Plasticity Length
Scale for Microelectronics Solder Alloys,” Trans. Of ASME Journal of Electronic
Packaging, ASME Journal of Electronic Packaging, Vo. 129, No. 2, pp-120-128,
June 2007. #66 |
|
86. |
Basaran, C., Nie, S., Hutchins, S. and Ergun, H. ,”Influence of Interfacial Bond
Strength on Fatigue Life and Mechanical Behavior of a Particulate Composite: An
Experimental Study, Int. J. of Damage Mechanics vol 17, no 2, March 2008, pp.
123-148 #54
|
|
87. |
Gomez, J. and Basaran, C. “Computational Implementation of Cosserat Continuum,”, International Journal of Materials and Production
Technology, Vol. 34, No 1-2, pp.3-36 January 2009 #78 |
|
88. |
Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration Induced Failure,”
Mechanics of Materials vol 40, no 1-2, Jan.-Feb. 2008, pp. 66-79 #74
|
|
89. |
Abdulhamid, M., Basaran, C.and Lai, Y.S., ”Thermomigration vs.
Electromigration in Lead-free Solder Joints,” IEEE Trans. On Advanced Packaging,
vol. 32, No 3, 627-635, August 2009 #79 |
|
90. |
Basaran, C., Nie, S. and Hutchins, C., "Time Dependent Behavior of a Particle
Filled Composite PMMA/ATH at Elevated Temperatures” Journal of Composite
Materials, vol 42, no 19, October, 2008, pp. 2003-2025 #55
|
|
91. |
Bicheng, C.and Basaran, C. “Automatic Full Strain Field Moiré Interferometry
Measurement with Nano-scale Resolution” Experimental Mechanics, vol 48, no 5,
October,2008, pp.665-673 #83
|
|
92. |
C. Basaran, S. Li, and M. F. Abdulhamid, "Thermomigration induced degradation
solder alloys," Journal of Applied Physics, vol. 103, p. 123520, 2008.
|
|
93. |
M. F. Abdulhamid, S. Li, and C. Basaran, "Thermomigration in lead-free joints,"
International Journal of Materials and Structural Integrity, vol. 2, pp. 11-34,
2008.#87 |
|
94. |
S.
Li, M. F. Abdulhamid, C. Basaran, and Y. Lai "Damage Mechanics of Low
Temperature Electromigration Thermomigration," Vol. 32, No 2, pp.478-485, May 2009 #85. |
|
95. |
S.
Li, M. F. Abdulhamid,and C. Basaran "Simulating Damage Mechanics of
Electromigration and Thermomigration," Transactions of the Society for Modeling and Simulation
International Vo. 84, No 8/9, pp. 391-401 August/September 2008 #91 |
|
96. |
Basaran, C., Abdulhamid, M.,”Effect of Thermomigration on Lead-free Solder Joint
Mechanical Properties,” Journal of Electronic Packaging,vol. 131, March 2009,
#80 |
|
97. |
Sellers, M. Li, S., Schultz, A., Basaran, C. and Kofke, D., ”Lattice Strain Due
to an Atomic Vacancy,” Int. J. Mol. Sci. 2009, 10(6), 2798-2808, #81 |
|
98. |
Li,
S. and Basaran, C. “A Damage Mechanics Model for Thermomigration,” Mechanics and
Materials, vol 42 Issue 3, March 2009 pp271-278 #82 |
|
99. |
Cemal Basaran, Shidong Li, Douglas C. Hopkins, and Damien Veychard
"Electromigration time to failure of SnAgCuNi solder joints"J. Appl. Phys. 106,
013707 (2009) #92
|
|
100. |
Cemal Basaran, Mohd F. Abdulhamid "Low temperature electromigration and
thermomigration in lead-free solder joints" Mechanics of Material. 41
1223?241(2009)#88
|
|
101. |
Tarek Ragab, Cemal Basaran "A framework for stress computation in single-walled
carbon nanotubes under uniaxial tension" Computational Materials Science 46
(2009) 1135?143 #89
|
|
102. |
Tarek Ragab and Cemal Basaran "Joule heating in single-walled carbon nanotubes "
JOURNAL OF APPLIED PHYSICS 106, 063705, #95 |
|
103. |
Shidong Li and Cemal Basaran "Effective Diffusivity of Lead-Free Solder Alloys "
Computational Materials Science 47, (2009) 71-78, #90 |
|
104. |
Mustafa Eray Gunel and Cemal Basaran "Micro-deformation mechanisms in
thermoformed alumina trihydrate reinforced poly (methyl methacrylate)" Materials
Science and Engineering: A, 523 (2009) 160-172, #99 |
|
105. |
Michael S. Sellers,Andrew J. Schultz, Cemal Basaran and David A. Kofke
"Atomistic Modeling of beta-Sn Surface Energies and Adatom Diffusivity " Applied
Surface Science, 256, (2010) 4402-4407. #93 |
|
106. |
Tarek Ragab and Cemal Basaran "Semi-classical transport for predicting joule
heating in carbon nanotubes" Physics Letters A, Vol.374 Issue 24 (2010) pp.
2475-2479, #102 |
|
107. |
Michael S. Sellers,Andrew J. Schultz, Cemal Basaran and David A. Kofke "Beta-Sn
Grain Boundary Structure and Self-Diffusivity via Molecular Dynamics Simulation"
Physical Review B, 81, 134111 (2010) #103 |
|
108. |
Mustafa Eray Gunel and Cemal Basaran "Stress Whitening Quantification in
Thermoformed of Mineral Filled Acrylics" ASME Journal of Engineering Materials
and Technology, July 2010, Vol. 132, 031002-11, #100 |
|
109. |
Ragab, T and Basaran, C."The prediction of the effective charge number in single
walled carbon nanotubes using Monte Carlo simulation" Carbon, 49, (2011)
425-434, #104 |
|
110. |
Chen, B. and Basaran, C." Statistical Phase Shifting Step Estimation Algorithm
Based on the Continuous Wavelet Transform for High Resolution Interferometry
Metrology "Applied Optics, Vol. 50, No 4, 586-593, February 2011 # 98 |
|
111. |
Sellers, M., Schultz, A. J., Kofke, D., and Basaran , C"Solute Effects on βSn
Grain Boundary Energy and Shear Stress" ASCE J. of Nanomechanics and
Micromechanics ,Vol. 1, Number 1, pp. 41-50, March 2011, #109 |
|
112. |
Chen, B. and Basaran, C."Measuring Joule Heating and Strain Induced by
Electrical Current with Moiré Interferometery" Applied Physics Journal , 109,
074908 (2011) # 97 |
|
113. |
Ragab, T. and Basaran, C."The Unraveling of Open-Ended Single Walled CarbonNanotubes
Using Molecular Dynamics Simulation " ASME Journal of ElectronicPackaging, June 2011,
Vol. 133, 020903-1- 7, #107 |
|
114. |
Lee, Y. and Basaran, C."Aviscoplasticity model for solder alloys
" Trans. Of ASME, J. of ElectronicPackaging, vol. 133, issue 4, December 2011,#101 |
|
115. |
Sellers, M., Schultz, A. J., Basaran , C. and Kofke, D."Effect of Cu and Ag Solute Segregation on Sn Grain Boundary Diffusivity " Journal of Applied Physics, vol. 110, issue 1, July 2011,#110 |
|
116. |
Chen, B. and Basaran, C."Near Field Modeling of the Moiré Interferometry for Nanoscale Strain Measurement " Journal of Optics and Lasers in Engineering, vol. 50, issue 7, July 2012,#111 |
|
117. |
Yao, W. and Basaran, C."Electromigration Analysis of Solder Joints under AC Load: a Mean Time to Failure Model " J. of Applied Physics, vol. 111, issue 6, March 2012,#115 |
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118. |
Chen, B. and Basaran, C. "Far-Field Modeling of Moiré Interferometry using Scalar Diffraction Theory " Journal of Optics and Lasers in Engineering, vol. 50, issue 8, August 2012,#112 |
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119. |
Yao, W., Basaran. C."Reduced Impedance and Super Conductivity of Lead-free Solder Alloys at Very High Frequencies " Electronic Materials Letters, vol. 8, issue 5, October 2012,#118 |
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120. |
Gunel, E.M. and Basaran, C."Damage Characterization in Non-Isothermal Stretching of Acrylics: Part I Theory " Mechanics of Materials, vol. 43, issue 12, December 2011,#105 |
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121. |
Gunel, E.M. and Basaran, C."Damage Characterization in Non-Isothermal Stretching of Acrylics: Part II Experimental Validation " Mechanics of Materials, vol. 43, issue 12, December 2011,#106 |
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122. |
Basaran, C. and Gunel, E. M."redicting Elastic Modulus of Particle Filled Composites "Int. J of Materials and Structural Integrity, (Accepted March 2012),#120 |
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123. |
Lee, Y. and Basaran, C."Molecular Dynamics of Visco-Plasticity in Tin Lattice and Grain Boundary " Computational Material Science, vol. 68, January 2013,#116 |
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124. |
Gautreau, P., Ragab, T., Basaran, C."Hot Phonons Contribution to Joule Heating in Single-Walled Carbon Nanotubes " Journal of Applied Physics, vol. 112, issue 10, November 2012,#119 |
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125. |
Gunel, E.M. and Basaran, C."Influence of Filler Content and Interphase properties on Large Deformation Micromechanics of Particle Filled Acrylics " Mechanics of Materials, vol. 57, February 2013,#108 |
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126. |
Lee, Y. and Basaran, C."Molecular Dynamics Simulations of Tin Lattice in Shear "ASCE J. of Nanomechanics and Micromechanics, Vol. 3, No. 4, December 2013,#123 |
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127. |
Yao, W., Basaran. C."Electromigration in Lead-Free Solder Joints under High Frequency Pulsed Current: an Experimental Study " Int. J. of Damage Mechanics, Int. J. of Damage Mechanics, Volume 22 Issue 8 November 2013,#122 |
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128. |
Gautreau, P.,Ragab, T., Basaran, C. "Influence of Hot Phonons on Wind Forces in Metallic Single Walled Carbon Nanotubes " Carbon, 57, (2013),#126 |
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129. |
Yao, W., Basaran. C."Electrical Pulse Induced Impedance and Material Degradation in IC Chip Packaging " Electronic Materials Letters, Vol. 9, No. 5, (2013), #125 |
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130. |
Yao, W., Basaran. C."Electromigration Damage Mechanics of Lead-Free Solder Joints Under Pulsed DC Loading: A Mean Time to Failure Model " Comp. Material Science, 71, (2013) ,#113 |
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131. |
Yao, W., Basaran. C."Damage Mechanics of Electromigration and Thermomigration in Lead-free Solder Alloys under AC: An Experimental Study " Int. J. of Damage Mechanics, Vol. 23 Issue 2 March 2014, pp. 203-221. #121 |
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132. |
Dongkeon Kim, Gary Dargush, Cemal Basaran, "A cyclic two-surface thermoplastic damage model with application to metallic plate dampers ", Engineering Structures Volume 52, July 2013, Pages 608–620. #132 |
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133. |
Lee, Y. and Basaran, C.," A multiscale modeling technique for bridging molecular dynamics with finite element method ", Journal of Computational Physics, 253 (November 2013) 64-85. #114 |
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134. |
Yao, W. and Basaran, C. " Computational Damage Mechanics of Electromigration and Thermomigration ", J. of Applied Physics, 114, 103708, (2013), #129 |
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135. |
Chu, Y., Ragab, T. and Basaran, C., " The size effect in mechanical properties of finite-sized graphene nanoribbon ", Computational Materials Science, 81 (2014) 269-274 #117 |
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136. |
Lee, Y. and Basaran, C. "Effect of Ni Solute on Grain Boundary Diffusivity and Structure of βSn ", Computational Materials Science 92 (2014) 1-7 #128 |
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137. |
Gautreau, P., Ragab, T. Chu, Y. and Basaran, C. " Phonon Dispersion and Quantization Tuning of Strained Carbon Nanotubes for Flexible Electronics ", J. Appl. Phys. 115, 243702 (2014) #133 |
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138. |
Chu, Y., Ragab, T., Gautreau, P., Basaran, C., "Mechanical Properties of Hydrogen-Edge-Passivated Chiral Graphene Nanoribbons ", (accepted ASCE J. Nanomechanics and Micromechanics, November 15, 2013). #131 |
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139. |
Chu, Y., Gautreau, P., Ragab, T. and Basaran, C., "An accelerated algorithm for full band electron phonon scattering rate computation ", Computer Physics Communications (accepted August 9, 2014) #135 |
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140. |
Chu, Y., Gautreau, P., Basaran, C. "Parity Conservation in Electron-Phonon Scattering of Zigzag Graphene Nanoribbon ", Applied Physics Letter, issue 11 volume 105, 15-Sep-2014. #136 |
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141. |
Gautreau, P., Chu, Y., Ragab, T., Basaran, C. "Phonon-Phonon Scattering Rates in Carbon Nanotubes ", Computational Materials Science, 103, (2015) 151-156 # 130 |
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142. |
Chu, Y., Ragab, T., Gautreau, P., Basaran, C. "Mechanical Properties of Hydrogen-Edge-Passivated Chiral Graphene Nanoribbons ", ASCE Journal of Nanomechanics and Micromechanics, 04015001-1, March 2015 . DOI: 10.1061/(ASCE)NM.2153-5477.0000101 #131 |
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143. |
Chu, Y., Gautreau, P., Ragab, T. and Basaran, C. "Temperature Dependence of Joule Heating in Zigzag Graphene Nanoribbon ", Carbon, 89, (2015) 169-175 #137 |
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144. |
Chu, Y., Gautreau, P., Ragab, T. and Basaran, C. "Strained Phonon-Phonon Scattering Rates in Carbon Nanotubes ", Computational Materials Science 112 (2016) 87–91, #134 |
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145. |
Fu, Y., Ragab, T., Basaran, C. "The Effect of Stone-Wales Defects on the Mechanical Behavior of Graphene Nano-Ribbons ", Computational Materials Science 124 (2016), 142-150, #142 |
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146. |
Ragab, T., Basaran, C. "A Quantum Mechanical Formulation of Electron Transport Induced Wind Forces in Metallic Single Walled Carbon Nanotubes ", Carbon 48 ( 2010), 47-53, #96 |
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147. |
Ragab, T. , McDonald, J., Basaran, C. "Aspect ratio effect on shear modulus and ultimate shear strength of graphene nanoribbons ", Diamond & Related Materials 74 (2017), #145 |
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148. |
Basaran, C. "Unification of Newtonian Mechanics and Thermodynamics: A Review Article ", MOJ Civil Engineering, (2016), #146 |
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149. |
Zhang, J., Ragab, T., Basaran, C , "Comparison of fracture behavior of defective armchair and zigzag graphene nanoribbons ", Int. J. of Damage Mechanics, (2018) #147 |
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150. |
Zhang, W., Basaran, C, Ragab, T. "Impact of Geometry on Transport Properties of Armchair Graphene Nanoribbon Heterojunction ", Carbon, 124 (2017) 422-428. #148 |
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151. |
Zhang, J., Ragab, T., Basaran, C. "Influence of Vacancy Defects on the Damage Mechanics of Graphene Nano Ribbons ", Int. J. of Damage Mechanics, (2016) #140 |
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152. |
Zhang, J., Ragab, T., Basaran, C. "The Effects of Vacancy Defect on the Fracture Behaviors of Zigzag Graphene Nanoribbons ", Int. J. of Damage Mechanics, (2016) #143 |
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153. |
Therence Temfack, Cemal Basaran. “Experimental Verification of a Thermodynamic Fatigue Life Prediction Mode”
Materials Science and Technology, Volume 31, Issue 13, 2015, # 138 |
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154. |
Lan, T., Ragab, T., Basaran, C. "Electron-Phonon Scattering and Joule Heating in Copper at Extreme Cold Temperatures ", Computational Material Science, (2018) #139 |
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155. |
Zhang, W., Ragab, T., Basaran, C. "Unraveling Properties in Armchair and Zigzag Graphene Nanoribbon ", Int. J of Damage Mechanics, (2016) # 141 |
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156. |
Ragab, T. , Basaran, C. "Shear strength of graphene nanoribbons beyond wrinkling ", Electronic Materials (2018) #144 |
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Contact Us:
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For further information, please contact Dr.
Cemal Basaran (cjb@buffalo.edu).
102 Ketter Hall • Buffalo,
New York 14260
• Phone: 716-645-4375 • Fax: 716-645-3733
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